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Symbol
Test Conditions
Characteristic Values
(T
J
= 25擄C, unless otherwise specified)
min. typ.
max.
500
0.102
2
-0.206
鹵100
T
J
= 25擄C
T
J
= 125擄C
200
1
0.15
0.16
4
V
%/K
V
%/K
nA
mA
mA
W
W
International standard packages
Low R
DS (on)
HDMOS
TM
process
Rugged polysilicon gate cell structure
Unclamped Inductive Switching (UIS)
rated
鈥?/div>
Low package inductance
- easy to drive and to protect
鈥?/div>
Fast intrinsic Diode
Applications
V
DSS
V
GS
= 0 V, I
D
= 1 mA
V
DSS
temperature coefficient
V
DS
= V
GS
, I
D
= 4 mA
V
GS(th)
temperature coefficient
V
GS
=
鹵20
V
DC
, V
DS
= 0
V
DS
= 0.8 鈥?V
DSS
V
GS
= 0 V
V
GS
= 10 V, I
D
= 15A
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DC-DC converters
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Battery chargers
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Switched-mode and resonant-mode
power supplies
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DC choppers
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AC motor control
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Temperature and lighting controls
Advantages
V
GS(th)
I
GSS
I
DSS
R
DS(on)
32N50
30N50
Pulse test, t
攏
300
ms,
duty cycle d
攏
2 %
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Easy to mount with 1 screw (TO-247)
(isolated mounting screw hole)
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Space savings
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High power density
97518H (6/99)
IXYS reserves the right to change limits, test conditions, and dimensions.
漏 2000 IXYS All rights reserved
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