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Bulletin I0148J rev. C 03/04

IR140CSP

Flipky

TM

1 Amp

Features

Ultra Low V

F

per Footprint Area

Low Thermal Resistance

One-fifth Footprint of SMA

Super Low Profile (<.8mm)

Available Tested on Tape & Reel

Flipky

TM

Major Ratings and Characteristics

Characteristics

I

F(AV)

Rectangular waveform

V

RRM

I

FSM

@ tp = 5 碌s sine

V

F

T

J

@ 1.0 Apk, T

J

=125擄C

range

Description

Units

A

V

A

V

擄C

True chip-scale packaging is available from International

Rectifier. The IR140CPS surface-mount Schottky

rectifier has been designed for applications requiring low

forward drop and very small foot prints on PC boards.

Typical applications are in disk drives, switching power

supplies, converters, free-wheeling diodes, battery

charging, and reverse battery protection.

Small foot print, surface mountable

Low forward voltage drop

High frequency operation

Guard ring for enhanced ruggedness and long term

reliability

The Flipky

TM

package, is one-fifth the footprint of a

comparable SMA package and has a profile of less then

.8mm. Combined with the low thermal resistance of the

die level device, this makes the Flipky

TM

the best device

for application where printed circuit board space is at a

premium and in extremely thin application environments

such as battery packs, cell phones and PCMCIA cards.

IR140CPS

1.0

40

250

0.38

- 55 to 150

www.irf.com

1

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