Thermal Resistance 鈥?/div>
Junction鈥搕o鈥揂mbient (Note 3.)
Total Power Dissipation @ T
A
= 25擄C
Continuous Drain Current @ 25擄C
Continuous Drain Current @ 70擄C
Pulsed Drain Current (Note 4.)
Operating and Storage
Temperature Range
Single Pulse Drain鈥搕o鈥揝ource Avalanche
Energy 鈥?Starting T
J
= 25擄C
(V
DD
= 20 Vdc, V
GS
= 5.0 Vdc, Peak I
L
= 7.5 Apk, L = 6 mH, R
G
= 25
鈩?
Maximum Lead Temperature for Soldering
Purposes, 1/8鈥?from case for 10 seconds
Symbol
V
DSS
V
DGR
V
GS
R
胃JA
P
D
I
D
I
D
I
DM
R
胃JA
P
D
I
D
I
D
I
DM
R
胃JA
P
D
I
D
I
D
I
DM
T
J
, T
stg
E
AS
Value
20
20
鹵10
50
2.5
5.9
4.7
25
100
1.25
4.2
3.3
20
162
0.77
3.3
2.6
15
鈥?5 to
+150
169
Unit
V
V
V
擄C/W
W
A
A
A
擄C/W
W
A
A
A
擄C/W
W
A
A
A
擄C
mJ
G
S
8
1
SO鈥?
CASE 751
STYLE 13
MARKING DIAGRAM
& PIN ASSIGNMENT
N.C.
Source
Source
Gate
1
2
3
4
Top View
E4N01
L
Y
WW
= Device Code
= Assembly Location
= Year
= Work Week
E4N01
LYWW
8
7
6
5
Drain
Drain
Drain
Drain
T
L
260
擄C
1. Mounted onto a 2鈥?square FR鈥? Board (1鈥?sq. 2 oz Cu 0.06鈥?thick single
sided), t
鈮?/div>
10 seconds.
2. Mounted onto a 2鈥?square FR鈥? Board (1鈥?sq. 2 oz Cu 0.06鈥?thick single
sided), t = steady state.
3. Minimum FR鈥? or G鈥?0 PCB, t = Steady State.
4. Pulse Test: Pulse Width = 300
ms,
Duty Cycle = 2%.
ORDERING INFORMATION
Device
NTMS4N01R2
Package
SO鈥?
Shipping
2500/Tape & Reel
漏
Semiconductor Components Industries, LLC, 2001
1
February, 2001 鈥?Rev. 2
Publication Order Number:
NTMS4N01R2/D
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