LQFP
Low Profile Quad Flat Pack
鈥?7 x 7mm to 28 x 28mm body sizes
鈥?32 to 208 lead counts
鈥?Lead pitch range from 0.80mm to
0.40mm
FEATURES
鈥?Body Sizes: 7 x 7mm to 28 x 28mm
鈥?Package Height: 1.4mm
鈥?Lead Counts: 32L to 208L
鈥?Lead Pitch: 0.80mm to 0.40mm
鈥?Wide range of open tool leadframe and die pad sizes
available
鈥?Moisture Sensitivity: JEDEC Level 3
鈥?JEDEC standard compliant
鈥?Lead-free and Green materials sets available
鈥?Copper and alloy leadframes available
DESCRIPTION
STATS ChipPAC鈥檚 LQFP is a low profile (1.4mm) version of
the QFP. The LQFP is a leadframe based, plastic encapsulated
package with gull wing shaped leads on four sides. The
LQFP offers pin counts up to 208, and is suitable for designs
with high I/Os while meeting low profile requirements and
for mainstream cost sensitive applications.
APPLICATIONS
鈥?3D Graphics
鈥?Multimedia
鈥?PC Chipsets
鈥?Video / Audio
鈥?Telecom
鈥?Disc Drives
鈥?Communication Boards (Ethernet, ISDN)
www.statschippac.com
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