data sheet
Features:
LEADFRAME
LQFP
PowerQuad
廬
2
High-performance operation and attributes of the LQFP
PowerQuad
廬
2 include the following:
鈥?High conductive, solid exposed heatsink
鈥?1.4 mm body for lightweight, portable applications
鈥?Direct die attach to heatsink
鈥?50% reduction in package self-inductance
鈥?50% improvement in
胃Ja
over standard LQFP
鈥?32 to 144 lead counts
鈥?7 x 7 - 20 x 20 mm body sizes
(JEDEC standard packages MS-026)
鈥?Heatsink-up and down configurations available
Thermal Resistance:
LQFP PowerQuad
廬
2
Packages:
LQFP PowerQuad
廬
2 (PQ2) is the same Amkor
patented, advanced IC packaging technology used
in plastic QFPs but applied to Low Profile 1.4 mm
QFPs (LQFP). This breakthrough in IC packaging
provides extraordinary gains in power dissipation
and speed through the use of innovative integrated,
embedded copper heatsink. The IC is attached
directly to the large, highly-efficient copper heatsink
which readily dissipates generated heat. To enhance
the thermal conduction from the IC to the mounting
surface, the LQFP PQ2 package leads are mechani-
cally connected, yet electrically isolated, to the
heatsink by a proprietary process. Thermal resist-
ance improvements greater than 55% are realized
with this technology and without the use of any
external cooling aids! The large heatsink also pro-
vides a 鈥渇loating鈥?ground plane to the signal leads
of the package thereby reducing self-inductance by
50% over conventional plastic LQFPs. In addition,
the patented LQFP PQ2 heatsink has integrated
mechanical 鈥渓ocking鈥?features to ensure total pack-
age integrity and eliminates moisture penetration.
The end result is a high-power, high-speed IC
package with the properties to enable new, smaller,
denser, portable electronic products and emerging
end applications to move from concept to
production.
Single-Layer PCB
Pkg
Body
Pad
Theta JA (擄C/W) by Velocity (LFPM)
Size (mm) Size (mm)
0
200 500
100 ld
208 ld
14 x 14
28 x 28
Body
Size(mm)
8.4
14.0
34.1
20.4
26.8
15.6
22.7
13.3
Multi-Layer PCB
Pkg
Pad
Theta JA (擄C/W) by Velocity (LFPM)
Size (mm)
0
200 500
100 ld
208 ld
14 x 14
28 x 28
8.4
14.0
18.1
12.8
15.5
10.4
14.1
9.3
Pre-JEDEC Standard Test Boards
Reliability:
Advanced design, manufacturing processes and materials
assure long-term reliable performance.
鈥?Temp cycle
鈥?Thermal shock (liq)
鈥?Autoclave
鈥?Temp/Humidity
鈥?High temp storage
-65/+150 擄C, 1000 cycles
-65/+150 擄C, 1000 cycles
121 擄C, 2 atm, 168 hours
85 擄C/85%RH, 1000 hours
150 擄C, 1000 hours
Applications:
Major semiconductor manufacturers and packaging engineers have chosen LQFP PQ2 as the IC package of choice for power microprocessors,
controllers, DSPs, high speed logic/FPGAs, PLDs, ASICs and other advanced technologies. System designers and OEM product developers find the
LQFP PQ2 solves power, thermal and speed concerns while supporting system constraints (standard package outlines, cost, SMT capability, product
availability, technical support) in uses such as: laptops, notebooks, telecom, cordless/wireless, high-end audio/video, CPU/GUI board systems and
many other small form-factor applications.
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS170G
Rev Date: 05鈥?6
1
2
