= 1 M鈩?/div>
Continuous
Transient
T
C
= 25擄C
T
C
= 25擄C, pulse width limited by T
JM
T
C
= 25擄C
Maximum Ratings
1000
1000
鹵20
鹵30
2
8
100
-55 ... +150
150
-55 ... +150
V
V
V
V
A
A
W
擄C
擄C
擄C
TO-220AB (IXTP)
GD
S
D (TAB)
TO-263 AA (IXTA)
G
S
D (TAB)
Mounting torque
1.13/10 Nm/lb.in.
4
300
g
擄C
G = Gate,
S = Source,
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
D = Drain,
TAB = Drain
Features
聼
聼
聼
聼
International standard packages
Low R
DS (on)
HDMOS
TM
process
Rugged polysilicon gate cell structure
Low package inductance (< 5 nH)
- easy to drive and to protect
聼
Fast switching times
Applications
聼
Switch-mode and resonant-mode
power supplies
聼
Flyback inverters
聼
DC choppers
Advantages
聼
Space savings
聼
High power density
Symbol
Test Conditions
Characteristic Values
(T
J
= 25擄C, unless otherwise specified)
min. typ. max.
1000
2
4.5
鹵100
T
J
= 25擄C
T
J
= 125擄C
200
1
7.0
V
V
nA
碌A(chǔ)
mA
鈩?/div>
V
DSS
V
GS(th)
I
GSS
I
DSS
R
DS(on)
V
GS
= 0 V, I
D
= 250
碌A(chǔ)
V
DS
= V
GS
, I
D
= 250
碌A(chǔ)
V
GS
=
鹵20
V
DC
, V
DS
= 0
V
DS
= 0.8 鈥?V
DSS
V
GS
= 0 V
V
GS
= 10 V, I
D
= 0.5 I
D25
Pulse test, t
鈮?/div>
300
碌s,
duty cycle d
鈮?/div>
2 %
IXYS reserves the right to change limits, test conditions, and dimensions.
97540A(5/98)
漏 2000 IXYS All rights reserved
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