PD- 94094
IRF7325
HEXFET
廬
Power MOSFET
Trench Technology
q
Ultra Low On-Resistance
q
Dual P-Channel MOSFET
q
Low Profile (<1.8mm)
q
Available in Tape & Reel
q
V
DSS
-12V
R
DS(on)
max (m鈩?
鈩?
24@V
GS
= -4.5V
33@V
GS
= -2.5V
49@V
GS
= -1.8V
I
D
鹵
7.8A
鹵
6.2A
鹵
3.9A
Description
New P-Channel HEXFET
廬
power MOSFETs from
International Rectifier utilize advanced processing
techniques to achieve extremely low on-resistance
per silicon area. This benefit, combined with the
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in a wide variety of applications.
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics and
multiple-die capability making it ideal in a variety of
power applications. With these improvements, multiple
devices can be used in an application with dramatically
reduced board space. The package is designed for
vapor phase, infrared, or wave soldering techniques.
S1
G1
S2
G2
1
8
D1
D1
D2
D2
2
7
3
6
4
5
T o p V ie w
SO-8
Absolute Maximum Ratings
Parameter
V
DS
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
P
D
@T
A
= 25擄C
P
D
@T
A
= 70擄C
V
GS
T
J,
T
STG
Drain- Source Voltage
Continuous Drain Current, V
GS
@ -4.5V
Continuous Drain Current, V
GS
@ -4.5V
Pulsed Drain Current
聛
Power Dissipation
聝
Power Dissipation
聝
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
Max.
-12
-7.8
-6.2
-39
2.0
1.3
16
鹵 8.0
-55 to + 150
Units
V
A
W
mW/擄C
V
擄C
Thermal Resistance
Symbol
R
胃JL
R
胃JA
Parameter
Junction-to-Drain Lead
Junction-to-Ambient
聝
Typ.
鈥撯€撯€?/div>
鈥撯€撯€?/div>
Max.
20
62.5
Units
擄C/W
www.irf.com
1
2/5/01
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