= 3.3m鈩?/div>
Description
Specifically designed for Automotive applications,
this HEXFET
廬
Power MOSFET utilizes the latest
processing techniques to achieve extremely low on-
resistance per silicon area. Additional features of
this design are a 175擄C junction operating tempera-
ture, fast switching speed and improved repetitive
avalanche rating . These features combine to make
this design an extremely efficient and reliable device
for use in Automotive applications and a wide variety
of other applications.
S
I
D
= 75A
TO-220AB
IRF3805
D
2
Pak
IRF3805S
Max.
220
160
75
890
130
2.2
鹵 20
TO-262
IRF3805L
Units
A
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25擄C
I
D
@ T
C
= 100擄C
I
D
@ T
C
= 25擄C
I
DM
P
D
@T
C
= 25擄C
V
GS
E
AS (Thermally limited)
E
AS
(Tested )
I
AR
E
AR
T
J
T
STG
Continuous Drain Current, V
GS
@ 10V
(Silicon Limited)
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
(Package limited)
Pulsed Drain Current
聶
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
W
W/擄C
V
mJ
A
mJ
擄C
d
脙聶
h
Operating Junction and
Storage Temperature Range
g
730
940
See Fig.12a, 12b, 15, 16
-55 to + 175
300 (1.6mm from case )
10 lbf in (1.1N m)
Thermal Resistance
R
胃JC
R
胃CS
R
胃JA
R
胃JA
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
i
y
y
Parameter
Junction-to-Case
Case-to-Sink, Flat Greased Surface
Junction-to-Ambient
Typ.
Max.
0.45
鈥撯€撯€?/div>
62
40
Units
擄C/W
i
i
鈥撯€撯€?/div>
0.50
鈥撯€撯€?/div>
鈥撯€撯€?/div>
Junction-to-Ambient (PCB Mount)
j
www.irf.com
1
10/21/04
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