Chip Schottky Barrier Diodes
FM820-B THRU FM840-B
Silicon epitaxial planer type
Formosa MS
SMB
0.213(5.4)
0.197(5.0)
0.016(0.4) Typ.
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy Molding Compound.
For surface mounted applications.
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
0.142(3.6)
0.126(3.2)
0.173(4.4)
0.157(4.0)
0.075(1.9)
0.067(1.7)
0.040(1.0) Typ.
0.040 (1.0) Typ.
Mechanical data
Case : Molded plastic, JEDEC DO-214AA
Terminals : Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by c athode band
Mounting P
osition : Any
Weight : 0.00878 ounce, 0.293 gram
Dimensions in inches and (millimeters)
o
MAXIMUM RATINGS
(AT T
A
=25 C unless otherwise noted)
PARAMETER
Forward rectified current
Forward surge current
See Fig.1
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
V
R
= V
RRM
T
A
=
25
o
C
I
R
Rq
JA
C
J
T
STG
-55
55
700
+150
CONDITIONS
Symbol
I
O
I
FSM
MIN.
TYP.
MAX.
8.0
150
5.0
50
o
UNIT
A
A
mA
mA
C / w
pF
o
Reverse current
Thermal resistance
Diode junction capacitance
Storage temperature
V
R
= V
RRM
T
A
= 100
o
C
Junction to ambient
f=1MHz and applied 4vDC reverse voltage
C
SYMBOLS
MARKING
CODE
SK82
SK83
SK84
V
RRM
*1
V
RMS
*2
V
R
*3
V
F
*4
Operating
temperature
(
o
C)
(V)
FM820-B
FM830-B
FM840-B
20
30
40
(V)
14
21
28
(V)
20
30
40
(V)
*1 Repetitive peak reverse voltage
*2 RMS voltage
0.65
-55 to +125
*3 Continuous reverse voltage
*4 Maximum forward voltage
1
2
