Formosa MS
FM5820-ALN THRU FM5822-ALN
Chip Schottky Barrier Diodes
Silicon epitaxial planer type
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy Molding Compound.
For surface mounted applications.
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
0.040(1.0) Typ.
SMA-LN
0.205(5.2)
0.189(4.8)
0.012(0.3) Typ.
0.110(2.8)
0.094(2.4)
0.181(4.6)
0.165(4.2)
0.075(1.9)
0.067(1.7)
0.040 (1.0) Typ.
0.067(1.7)
0.053(1.3)
Mechanical data
Dimensions in inches and (millimeters)
Case : Molded plastic, JEDE DO-214AC
C
Terminals : Solder plated, s olderable per MIL-STD-750,
Method 2026
Polarity : Indicated by cathode band
Mounting P
osition : Any
Weight : 0.0015 ounce, 0.15 gr am
MAXIMUM RATINGS
(AT T
A
=25
o
C unless otherwise noted)
PARAMETER
Forward rectified current
Forward surge current
See Fig.1
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
V
R
= V
RRM
T
A
=
25
o
C
o
CONDITIONS
Symbol
I
O
I
FSM
MIN.
TYP.
MAX.
3.0
80
0.5
20
UNIT
A
A
mA
mA
o
Reverse current
Thermal resistance
Diode junction capacitance
Operating temperature
I
R
Rq
JA
C
J
T
STG
-55
250
V
R
= V
RRM
T
A
= 125 C
Junction to ambient
f=1MHz and applied 4vDC reverse voltage
80
C / w
pF
+150
o
C
SYMBOLS
MARKING
CODE
SK32
SK33
SK34
V
RRM
*1
V
RMS
*2
V
R
*3
V
F
*4
Storage
temperature
(
o
C)
*1 Repetitive peak reverse voltage
*2 RMS voltage
(V)
FM5820-ALN
FM5821-ALN
FM5822-ALN
20
30
40
(V)
14
21
28
(V)
20
30
40
(V)
0.475
0.500
0.525
-55 to +125
*3 Continuous reverse voltage
*4 Maximum forward voltage
1
2
