FLLD261
HIGH CONDUCTANCE LOW LEAKAGE DIODE
P
D
. . . .350 mW @ T
A
= 25 Deg C
B
V
. . . .200 V (M
IN
) @ I
R
= 5 uA
ABSOLUTE MAXIMUM RATINGS
(NOTE 1)
TEMPERATURES
Storage Temperature
Operating Junction Temperature
-55 to +150 Degrees C
-55 to +150 Degrees C
PACKAGE
TO-236AB (Low)
3
P8A
1
2
CONNECTION DIAGRAMS
3
POWER DISSIPATION
(NOTES 2 & 3)
Total Device Dissipation at TA = 25 Deg C
Derating Factor per Degree C
350 mW
2.8 mW
1
2
VOLTAGES & CURRENTS
WIV
Working Inverse Voltage
IO
Average Rectified Current
IF
DC Forward Current
if
Recurrent Peak Forward Current
if (surge) Peak Forward Surge Current
Pulse width = 1 second
Pulse width = 1 microsec
100 V
250 mA
600 mA
700 mA
1.0 A
3.0 A
ELECTRICAL CHARACTERISTICS
(25 Degrees C Ambient Temperature unless otherwise stated)
SYM
B
V
I
R
V
F
C
T
T
RR
T
FR
V
FM
CHARACTERISTICS
Breakdown Voltage
Reverse Voltage Leakage Current
Forward Voltage
Diode Capacitance
Reverse Recovery Time
Forward Recovery Time
Peak Forward Voltage
MIN
200
MAX
UNITS
V
TEST CONDITIONS
I
R
=
5.0 uA
T
A
= 150 Deg C
5.0
5.0
1.40
4.0
400
10
0.9
Typ
nA
uA
V
pF
ns
ns
V
V
R
= 100 V
V
R
= 100 V
I
F
=
V
R
=
200 mA
1.0 V
f = 1.0 MH
Z
I
F
= I
R
= 50 to 400 mA
I
RR
= 10% I
R
R
L
= 100 ohms
I
F
=
10 mA
I
F
=
10 mA
Rise Time = 5 ns +/-20%
NOTES:
1. These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
2. These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.