鈩?/div>
@ V
GS
= 4.5 V.
High density cell design for extremely low R
DS(ON)
.
Proprietary SuperSOT
TM
-8 small outline surface mount
package with high power and current handling capability.
SOT-23
SuperSOT -6
TM
SuperSOT
TM
-8
SO-8
SOT-223
SOIC-16
S
D
D
S
5
6
7
4
3
2
1
10
44
D
G
pin
1
SuperSOT -8
TM
D
D
8
Absolute Maximum Ratings
Symbol
V
DSS
V
GSS
I
D
P
D
Parameter
Drain-Source Voltage
Gate-Source Voltage
Draint Current - Continuous
- Pulsed
Maximum Power Dissipation
T
A
= 25
o
C unless otherwise noted
FDR4410
30
鹵20
(Note 1a)
Units
V
V
A
9.3
40
(Note 1a)
(Note 1b)
(Note 1c)
1.8
1
0.9
-55 to 150
W
T
J
,T
STG
R
胃JA
R
胃JC
Operating and Storage Temperature Range
擄C
THERMAL CHARACTERISTICS
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)
70
20
擄C/W
擄C/W
FDR4410 Rev.C
漏 1998 Fairchild Semiconductor Corporation