鈥?/div>
Pb鈭扚ree Packages are Available*
G
MAXIMUM RATINGS
Rating
Drain 鈭扴ource Voltage
Gate鈭扴ource Voltage
Drain Current
Continuous (Note 1)
Pulsed (Note 2)
Total Power Dissipation
@ T
A
= 25擄C
Derate above T
A
= 25擄C
Operating and Storage Temperature Range
Symbol
V
DSS
V
GS
I
D
I
DM
P
D
350
6.4
T
J
, T
stg
鈭?5 to +150
mW
mW/擄C
擄C
1
2
3
S
Value
200
鹵20
250
500
BS108
AYWW
G
G
Unit
Vdc
Vdc
mAdc
MARKING
DIAGRAM
TO鈭?2
CASE 29鈭?1
STYLE 30
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. The Power Dissipation of the package may result in a lower continuous drain
current.
2. Pulse Test: Pulse Width
v
300
ms,
Duty Cycle
v
2.0%.
BS108 = Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb鈭扚ree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
BS108
BS108G
BS108ZL1
BS108ZL1G
Package
TO鈭?2
TO鈭?2
(Pb鈭扚ree)
TO鈭?2
TO鈭?2
(Pb鈭扚ree)
Shipping
1000 Units/Box
1000 Units/Box
2000/Ammo Pack
2000/Ammo Pack
*For additional information on our Pb鈭扚ree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred
devices are recommended choices for future use
and best overall value.
漏
Semiconductor Components Industries, LLC, 2006
1
February, 2006 鈭?Rev. 2
Publication Order Number:
BS108/D