鈮?/div>
50
ms)
Drain Current
Continuous (Note 1)
Pulsed (Note 2)
Total Device Dissipation @ T
A
= 25擄C
Derate above 25擄C
Operating and Storage Junction
Temperature Range
Unit
Vdc
G
Vdc
Vpk
mAdc
S
MARKING
DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. The Power Dissipation of the package may result in a lower continuous drain
current.
2. Pulse Test: Pulse Width
v
300
ms,
Duty Cycle
v
2.0%.
A
xxx
YWW
G
G
1
2
xxx
= BS107 or BS107A
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
BS107
BS107G
BS107A
BS107AG
Package
TO-92
TO-92
(Pb-Free)
TO-92
TO-92
(Pb-Free)
TO-92
TO-92
(Pb-Free)
Shipping
1000 Units/Box
1000 Units/Box
1000 Units/Box
1000 Units/Box
BS107ARL1
BS107ARL1G
2000/Ammo Pack
2000/Ammo Pack
*For additional information on our Pb-Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
漏
Semiconductor Components Industries, LLC, 2007
Preferred
devices are recommended choices for future use
and best overall value.
1
October, 2007 - Rev. 5
Publication Order Number:
BS107/D