鈼?/div>
Highly Integrated Solution
鈥?Requires no external components
鈥?Incorporates on-chip internal memory for packet buffering and
queueing
鈥?Integrates three 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
鈥?Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
鈥?Supports ECRC and Advanced Error Reporting
鈥?Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
鈥?Compatible with Hot-Plug I/O expanders used on PC mother-
boards
Power Management
鈥?Utilizes advanced low-power design techniques to achieve low
typical power consumption
鈥?Supports PCI Power Management Interface specification (PCI-
PM 1.2)
鈥?Unused SerDes are disabled.
鈥?Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
鈥?Built in Pseudo-Random Bit Stream (PRBS) generator
鈥?Numerous SerDes test modes
鈥?Ability to bypass link training and force any link into any mode
鈥?Provides statistics and performance counters
Block Diagram
3-Port Switch Core / 3 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
Figure 1 Internal Block Diagram
(Port 3)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
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漏
2007 Integrated Device Technology, Inc.
*Notice: The information in this document is subject to change without notice
September 7, 2007
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