Plastic Packages for Integrated Circuits
Single-In-Line Plastic Packages (SIP)
-A-
E
L2
A
0.006
(0.15)
-B-
C2
Z5.067A
5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE SURFACE MOUNT
鈥淕ULLWING鈥?LEAD FORM
INCHES
SYMBOL
MIN
0.170
0.048
0.350
0.395
0.310
0.310
0.549
0.068
0.045
MAX
0.180
0.055
0.370
0.405
-
-
0.569
0.088
0.055
MILLIMETERS
MIN
4.32
1.22
8.89
10.04
7.88
7.88
13.95
1.72
1.15
MAX
4.57
1.39
9.39
10.28
-
-
14.45
2.24
1.40
NOTES
-
5
-
-
-
-
-
-
-
4
5, 6, 7
5
-
Rev. 3 4/03
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-169AB, Issue A.
2. Controlling dimension: Inch.
3. Dimensioning and tolerance per ANSI Y14.5M-1982.
4. Gauge plane L3 is parallel to heatslug plane.
5. Dimensions include lead finish.
6. Leads are not allowed above the datum -B- .
7. Dimension 鈥渂鈥?does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed the
maximum 鈥渂鈥?by more than 0.003鈥欌€?(0.08mm).
D
-C-
L
HEATSLUG
PLANE
0.00 - 0.0098
(0.00 - 0.25)
L1
A
C2
D
E
D1
PIN
#1
c
e
b
0.010 (0.25) M B A M
C M
L3
0.450
(11.43) MIN
0.004
(0.10)
0
o
- 8
o
E1
L
L1
L2
L3
0.030 BSC
0.028
0.018
0.037
0.024
0.76 BSC
0.71
0.46
0.94
0.60
E1
b
c
e
0.067 BSC
1.70 BSC
D1
0.609
(15.46)
MIN
BACK VIEW
0.350
(8.89)
MIN
0.129
(3.27)
TYP
0.043
(1.09)
TYP
e
LAND PATTERN
1
INTERSIL
1
