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WS512K32-XXX

512Kx32 SRAM MODULE, SMD 5962-94611

FEATURES

n

Access Times of 15*, 17, 20, 25, 35, 45, 55ns

n

Packaging

聲 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP

(Package 400).

聲 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140")

(Package 502)

1

, Package to be developed.

聲 68 lead, Hermetic CQFP (G2T)

1

, 22.4mm (0.880") square

(Package 509) 4.57mm (0.180") height.

Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).

聲 68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square

(Package 519) 3.57mm (0.140") height.

Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).

聲 68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square

(Package 524) 4.06mm (0.160") height.

n

Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8

n

Commercial, Industrial and Military Temperature Ranges

n

TTL Compatible Inputs and Outputs

n

5 Volt Power Supply

n

Low Power CMOS

n

Built-in Decoupling Caps and Multiple Ground Pins for Low

Noise Operation

n

Weight

WS512K32-XH1X - 13 grams typical

WS512K32-XG2TX

1

- 8 grams typical

WS512K32-XG1UX - 5 grams typical

WS512K32-XG1TX - 5 grams typical

WS512K32-XG4TX

1

- 20 grams typical

* 15ns Access Time available only in Commercial and Industrial Temperature.

This speed is not fully characterized and is subject to change without notice.

Note 1: Package Not Recommended For New Design

FIG. 1

PIN CONFIGURATION FOR WS512K32N-XH1X

TOP VIEW

PIN DESCRIPTION

I/O

0-31

A

0-18

WE

1-4

CS

1-4

OE

V

CC

GND

NC

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

Output Enable

Power Supply

Ground

Not Connected

BLOCK DIAGRAM

November 2001 Rev. 9

1

White Electronic Designs Corporation 聲 (602) 437-1520 聲 www.whiteedc.com

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