White Electronic Designs
WEDPS512K32V-XBX
512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
FEATURES
n
Access Times of 12, 15, 17, 20ns
n
Packaging
鈥?143 PBGA, 16mm x 18mm, 288mm
2
n
Organized as 512Kx32; User Configurable as 1Mx16 or
2Mx8
n
Commercial, Industrial and Military Temperature Ranges
n
Low Voltage Operation:
鈥?3.3V 鹵 10% Power Supply
n
Low Power CMOS
n
TTL Compatible Inputs and Outputs
n
Fully Static Operation:
鈥?No clock or refresh required.
n
Three State Output.
Note: This data sheet describes a product that is subject to change without notice.
P
IN
C
ONFIGURATION
F
OR
WEDPS512K32V-XBX
T
OP
V
IEW
1
A
-
2
A2
A3
D8
D11
GND
GND
V
CC
V
CC
D0
D3
A6
A7
3
A1
A4
NC
GND
GND
GND
V
CC
V
CC
V
CC
NC
A5
A8
4
A0
D14
D12
GND
GND
GND
V
CC
V
CC
V
CC
D7
D6
A9
5
GND
D15
D13
GND
GND
GND
V
CC
V
CC
V
CC
D5
D4
V
CC
6
GND
NC
GND
GND
GND
GND
V
CC
V
CC
V
CC
V
CC
NC
V
CC
7
V
CC
CS4
V
CC
V
CC
V
CC
V
CC
GND
GND
GND
GND
WE3
GND
8
V
CC
D24
D26
V
CC
V
CC
V
CC
GND
GND
GND
D17
D19
GND
9
A18
D25
D27
V
CC
V
CC
V
CC
GND
GND
GND
D16
D18
A10
10
A17
OE
WE4
V
CC
V
CC
V
CC
GND
GND
GND
CS3
A14
A11
11
A16
A15
D31
D28
V
CC
V
CC
GND
GND
D23
D20
A13
A12
12
GND
NC
D30
D29
NC
V
CC
GND
NC
D22
D21
NC
V
CC
B
C
D
E
F
G
H
J
K
L
M
CS2
D9
D10
WE2
GND
V
CC
CS1
D1
D2
WE1
GND
P
IN
D
ESCRIPTION
I/O
0-31
A
0-18
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
8
B
LOCK
D
IAGRAM
W E
1
CS
1
OE
A
0
-
18
512K x 8
512K x 8
512K x 8
512K x 8
W E
2
CS
2
W E
3
CS
3
W E
4
CS
4
8
8
8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
February 2003 Rev. 4
1
White Electronic Designs Corporation 鈥?(602) 437-1520 鈥?www.whiteedc.com