White Electronic Designs
WED3C7410E16M-400BX
RISC Microprocessor Multichip Package
*PRELIMINARY
OVERVIEW
The WEDC 7410E/SSRAM multichip package is targeted for
high performance, space sensitive, low power systems and
supports the following power management features: doze,
nap, sleep and dynamic power management.
The WED3C7410E16M-400BX multichip package consists
of:
鈥?7410E AltiVec餂?RISC processor
鈥?Dedicated 2MB SSRAM L2 cache, configured as
256Kx72
鈥?21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
鈥?Maximum Core frequency = 400MHz @ 1.8V
鈥?Maximum L2 Cache frequency = 200MHz
鈥?Maximum 60x Bus frequency = 100MHz
The WED3C7410E16M-400BX is offered in Commercial (0擄C
to +70擄C), industrial (-40擄C to +85擄C) and military (-55擄C
to +125擄C) temperature ranges and is well suited for em-
bedded applications such as missiles, aerospace, flight
computers, fire control systems and rugged critical systems.
*This data sheet describes a product that is developmental, is not qualified or
characterized and is subject to change without notice.
FEATURES
n
Footprint compatible with WED3C7558M-XBX and
WED3C750A8M-200BX
n
Implementation of Altivec錚?technology instruction set
n
Optional, high-bandwidth MPX bus interface
F
IG
. 1 M
ULTI
-C
HIP
P
ACKAGE
D
IAGRAM
AltiVec餂?is a trademark of Motorola Inc.
October 2002 Rev. 5
1
White Electronic Designs Corporation 鈥?(602) 437-1520 鈥?www.whiteedc.com