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White Electronic Designs

WED3C7410E16M-400BX

RISC Microprocessor Multichip Package

*PRELIMINARY

OVERVIEW

The WEDC 7410E/SSRAM multichip package is targeted for

high performance, space sensitive, low power systems and

supports the following power management features: doze,

nap, sleep and dynamic power management.

The WED3C7410E16M-400BX multichip package consists

of:

鈥?7410E AltiVec餂?RISC processor

鈥?Dedicated 2MB SSRAM L2 cache, configured as

256Kx72

鈥?21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)

鈥?Maximum Core frequency = 400MHz @ 1.8V

鈥?Maximum L2 Cache frequency = 200MHz

鈥?Maximum 60x Bus frequency = 100MHz

The WED3C7410E16M-400BX is offered in Commercial (0擄C

to +70擄C), industrial (-40擄C to +85擄C) and military (-55擄C

to +125擄C) temperature ranges and is well suited for em-

bedded applications such as missiles, aerospace, flight

computers, fire control systems and rugged critical systems.

*This data sheet describes a product that is developmental, is not qualified or

characterized and is subject to change without notice.

FEATURES

n

Footprint compatible with WED3C7558M-XBX and

WED3C750A8M-200BX

n

Implementation of Altivec錚?technology instruction set

n

Optional, high-bandwidth MPX bus interface

F

IG

. 1 M

ULTI

-C

HIP

P

ACKAGE

D

IAGRAM

AltiVec餂?is a trademark of Motorola Inc.

October 2002 Rev. 5

1

White Electronic Designs Corporation 鈥?(602) 437-1520 鈥?www.whiteedc.com

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