WIRE-WOUND
RF CHIP INDUCTORS
Application Notes
The Basics of Wire-Wound Chip Inductors
Pulse currently supplies high quality magnetic products to companies such as 3COM, Cisco, Ericsson, Intel, Marconi,
Nokia and Nortel and has been active in the field of RF engineering, since the launch of its first wire-wound 1008 chip
product in 1982. Pulse now offers five ranges of wire-wound chip from 0402 to 1210 (see table 1.0 below): the "CD
Range" with 100% compatibility to other market leaders, and the "CM and CQ ranges" with improved electrical
performance with a Ceramic core construction; the FD and FT series with a Ferrite core construction.
In recent years, Pulse has leveraged its strength within the Telecoms and Networking industry to extend its product
range to encompass RF products for the Cable Modem, CATV, MMDS and TETRA markets. Pulse now also offers
Wide Bandwidth RF Transformers, Splitter Combiners, Couplers, Diplexers, Low Pass Filters and High Power
Impedance Matching Transformers. To explore the complete range of RF products, visit the Pulse website:
http://www.pulseeng.com./Products/finder/rf_hfc_cable.htm for cable products
and
http://www.pulseeng.com/scripts/finder/rfind/mcis.cfm for RF chip inductors.
Pulse
Part No.
PE-0402CD
PE-0603CD
PE-0805CD
PE-0805CM
PE-0805FT
PE-1008CD
PE-1008CM
PE-1008CQ
PE-1008FD
PE-1210FT
PE-1206CD
Inductance
Range (nH)
1.0 ~ 120
1.8 ~ 390
3.3 ~ 1500
3.3 ~ 680
1000 ~ 68000
4.7 ~ 5600
4.7 ~ 4700
3.0 ~ 220
150 ~ 10000
10 ~ 12000
3.3 ~ 1200
Number
of Values
28
32
32
25
12
39
40
13
15
38
28
Tolerance Range
5 & 10%
2, 5, 10 & 20%
1, 2, 5, 10 & 20%
1, 2, 5, & 10%
5 & 10%
2, 5 & 10%
1, 2, 5, 10 & 20%
5 & 10%
5 & 10%
5 & 10%
5 & 10%
Availability
In Mass Production
In Mass Production
In Mass Production
In Mass Production
In Mass Production
In Mass Production
In Mass Production
In Mass Production
In Mass Production
In Mass Production
In Mass Production
Table 1.0 Pulse Chip Inductor Product Range
Competing Chip Inductor Types
Capacitor and resistors are available in a wide variety of sizes and component values and it is possible to purchase
almost any value, tolerance or other rating. Inductors, on the other hand, are not so readily available and engineers
may find it necessary to wind their own inductors to get a specific value of inductance.
There are mainly 3 varieties of inductor in common use today and they are wire-wound, multi-layer and drum core chip
inductors. The primary differences between these competing types are the core material used to enhance the induc-
tance of coil and the construction method. Wire is wound around a ceramic or ferrite bobbin or in the case of multi-
layer the coil is formed by interconnecting layers of conductive material printed on a ceramic substrate.
Table 2.0 indicates that the performance merits of wire-wound inductors versus the alternative multi-layer and drum
core platforms. If price were the only consideration then, of course, there would be no market available for wire-wound
chip inductors. But price is not the only consideration, since RF engineers must also consider the needs of the applica-
tion in terms of Q factor, Idc (maximum current carrying capacity). Rdc (resistance at dc), Tolerance and SRF (self-
resonant or series resonant frequency.
SMT
Chip Inductor
Chip Inductor
Multi-layer
Drum Core
Technology
Wire-wound
Wire-wound
Printed
Wire-wound
Material
Substrate
Ceramic
Ferrite
Ceramic
Ferrite
Q Factor
High
Low
Low
Low
SRF
High
Low
Low
Low
Idc
High
High
Low
Low
Tolerance
Good
Poor
Poor
Poor
Table 2.0 Summary of Chip Inductor Relative Performance
US 858 674 8100
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UK 44 1483 401 700
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France 33 3 84 35 04 04
鈥?/div>
Singapore 65 287 8998
鈥?/div>
Taiwan 886 2 2698 0228
鈥?/div>
Hong Kong 852 2788 6588
鈥?/div>
http://www.pulseeng.com
WC701.D (12/02)
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