W82M32V-XBX
2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE
FEATURES
Access Times of 12, 15, 17, 20ns
Packaging
鈥?255 PBGA, 25mm x 25mm, 625mm
2
Organized as 2Mx32
Commercial, Industrial and Military Temperature
Ranges
Low Voltage Operation:
鈥?3.3V 鹵 10% Power Supply
ADVANCED*
Low Power CMOS
TTL Compatible Inputs and Outputs
Fully Static Operation:
鈥?No clock or refresh required.
Three State Output.
* Advanced data sheet describes a product that is developmental,
non-qualified and is subject to change or cancellation without notice.
P
IN
C
ONFIGURATION
F
OR
W82M32V-XBX
T
OP
V
IEW
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
2
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
3
NC
NC
NC
CS
2
D
9
D
10
4
NC
NC
A
2
A
3
D
8
D
11
5
NC
NC
A
1
A
4
A
19
6
NC
NC
A
0
D
14
D
12
7
NC
NC
D
15
8
NC
NC
NC
9
NC
NC
CS
4
10
NC
NC
V
CC
D
24
D
26
V
CC
V
CC
V
CC
11
NC
NC
A
18
D
25
D
27
V
CC
V
CC
V
CC
12
NC
NC
A
17
OE
WE
4
V
CC
V
CC
V
CC
13
NC
NC
A
15
D
31
D
28
V
CC
14
NC
NC
NC
D
30
D
29
NC
15
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
16
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
GND GND V
C C
D
13
GND V
C C
A
16
GND
GND GND GND GND V
C C
WE
2
GND GND GND GND GND V
C C
GND GND GND GND GND GND V
C C
V
CC
V
CC
CS
1
V
C C
D
1
D
2
WE
1
GND
NC
NC
D
0
D
3
A
6
A
7
NC
NC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
A
20
A
5
A
8
NC
NC
D
7
D
6
A
9
NC
NC
V
CC
V
CC
NC
D
22
D
21
NC
NC
NC
V
C C
V
C C
GND GND GND GND GND GND
V
C C
V
C C
GND GND GND GND GND
V
C C
V
C C
GND GND GND GND
D
5
D
4
NC
NC
V
C C
GND
NC
NC
WE
3
NC
NC
D
17
D
19
NC
NC
D
16
D
18
A
10
NC
NC
CS
3
A
14
A
11
NC
NC
D
23
D
20
A
13
NC
NC
V
C C
V
C C
GND GND
A
12
VCC
P
IN
D
ESCRIPTION
I/O
0-31
Data Inputs/Outputs
A
0-20
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
2M
B
LOCK
D
IAGRAM
2M
2M
2M
November 2003 Rev. 3
1
White Electronic Designs Corporation 鈥?(602) 437-1520 鈥?www.whiteedc.com