W238
FTG for Integrated Core Logic with 133-MHz FSB
Features
鈥?Maximized EMI suppression using Cypress鈥檚 Spread
Spectrum technology
鈥?Low jitter and tightly controlled clock skew
鈥?Highly integrated device providing clocks required for
CPU, core logic, and SDRAM
鈥?Two copies of CPU clock at 66/100/133 MHz
鈥?Thirteen copies of SDRAM clocks at 100/133 MHz
鈥?Five copies of PCI clock compliant to PCI spec 2-1 and
capable of driving a maximum load of 40pf
鈥?One copy of synchronous APIC clock
鈥?Two copies of 48-MHz clock (non-spread spectrum) op-
timized for USB reference input and video dot clock
鈥?Three copies of 66-MHz fixed clock
鈥?One copy of 14.31818-MHz reference clock
鈥?Power down control
鈥?SMBus interface for turning off unused clocks
APIC, 48-MHz, SDRAM Output Skew: ........................250 ps
CPU, 3V66 Output Skew:............................................175 ps
PCI Output Skew:........................................................500 ps
CPU to SDRAM Skew (@ 133 MHz):.........................鹵0.5 ns
CPU to SDRAM Skew (@ 100 MHz):.................4.5 to 5.5 ns
CPU to 3V66 Skew (@ 66 MHz): .......................7.0 to 8.0 ns
3V66 to PCI Skew (3V66 lead):..........................1.5 to 3.5 ns
PCI to APIC Skew: .....................................................鹵0.5 ns
Table 1. Pin Selectable Functions
Tristate#
0
0
1
1
1
1
FSEL1
X
X
0
0
1
1
FSEL0
0
1
0
1
0
1
Function
Three -State
Test
66 MHz
100 MHz
133 MHz
133 MHz
SDRAM
Three-State
Test
100 MHz
100 MHz
133 MHz
100 MHz
Key Specifications
CPU, SDRAM Outputs Cycle-to-Cycle Jitter:.............. 250 ps
APIC, 48-MHz, 3V66, PCI Outputs
Cycle-to-Cycle Jitter:................................................... 500 ps
Block Diagram
VDDQ3
Pin Configuration
[1]
APIC
VDDQ2
GND
REF/FSEL1
VDDQ3
X1
X2
GND
VDDQ3
3V66_0
3V66_1
3V66_AGP
GND
PCI_ICH
PCI1
PCI2
VDDQ3
GND
PCI3
PCI4
FSEL0
GNDA
VDDA
SCLK
SDATA
GND
VDDQ3
USB
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
GND
VDDQ2
CPU0
CPU1
GND
SDRAM0
SDRAM1
VDDQ3
GND
SDRAM2
SDRAM3
SDRAM4
SDRAM5
VDDQ3
GND
SDRAM6
SDRAM7
SDRAM8
SDRAM9
VDDQ3
GND
SDRAM10
SDRAM11
VDDQ3
GND
SDRAM12
PWRDWN#/TRISTATE#
DOT
X1
X2
XTAL
OSC
PLL REF FREQ
REF/FSEL1
VDDQ2
SDATA
SCLK
SMBus
Logic
Divider,
Delay,
and
Phase
Control
Logic
CPU0:1
2
APIC0:1
VDDQ3
W238
2
FSEL0:1
PLL 1
2
3V66_0:1
3V66_AGP
PCI0_ICH
4
13
PWRDWN#/TRISTATE#
PCI1:4
SDRAM0:12
PLL2
VDDQ3
USB
DOT
Note:
1. Internal pull-down resistors present on input marked with *.
Design should not solely rely on internal pull-down resister to
set I/O pin LOW.
Cypress Semiconductor Corporation
Document #: 38-07219 Rev. *A*
鈥?/div>
3901 North First Street
鈥?/div>
San Jose
鈥?/div>
CA 95134 鈥?408-943-2600
Revised December 15, 2002
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