VISHAY
VESD05C-FC1
Vishay Semiconductors
Flip Chip Protection Diode - Chip Size 0402
Description
Flip Chip is a chip with all packaging and interconnec-
tions manufactured on the wafer prior to dicing. The
interconnections are made of solder bumps on i/o
pads.Our device utilizes a silicon P/N junction for
excellent clamping (protection) performance with low
leakage current characteristic.
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2
19120
Features
鈥?ESD protection to IEC 61000-4-2 30 kV (air)
鈥?ESD protection to IEC 61000-4-2 8 kV (contact)
鈥?ESD protection to IEC 61000-4-5
(lightning): 8/20
碌s,
I
PPM
= 10 mA
鈥?120 W peak pulse power dissipation per line
(8/20
碌s)
鈥?Suitable for high frequency applications
(low capacitance, low parasitic inductance)
鈥?Low clamping voltage
鈥?Minimum PCB space needed (0.5 mm
2
),
< 0.55 mm height, only 0.47 mg/pcs
鈥?No need for underfill material and/or additional
solder
鈥?Can be assembled using standard SMT pick &
place equipment, reflow processes per J-STD-020
and assembly methods
鈥?Green product
Applications
Cellular phones
Personal digital assistants (PDA), notebook
computers
MP3 players
GPS
Digital cameras
Bluetooth
Audio amplifiers
DVD
Power management systems
Read write heads for hard drives
Modules for watches
CPU
Digital TV鈥檚 and sattelites receivers
SMART cards
Mechanical Data
Case:
Flip Chip 1005
Standard EIA chip size: 0402
8 mm tape and reel per EIA-481-1-A/IEC60286
Top contacts: 4 solder bumps 100
碌m
in height
(nominal)
Bumps of SnAgCu (lead-free)
1)
1)
also available with PbSn bumps
Document Number 85859
Rev. 1.1, 14-Jul-04
www.vishay.com
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