Fiber Optics
Heatsink for PAROLI
廬
Backplane Module
V23814-Z6-Z1
1
General Scope
This data sheet describes the detachable heatsink for PAROLI
廬
Backplane module
V23814-x1306-M133
1)
(transmitter) resp. V23815-x1306-M133
1)
(receiver).
2
Technical Data
See
Figure 1.
Dimensions
Material
Coefficient of thermal conduction
No. of fins
45 x 24 x 8.75鹵0.2 mm (L x W x H)
Al Mg 4.5 Mn, black anodized
110鈥?40 W m
鈥?
K
鈥?
14 (1.4 mm width)
3
Application and Assembly
Application is the use of the heatsink to attach onto the module baseplate.
For optimized heat transfer between module and heatsink Infineon recommends to use
a heat dissipation foil between both parts (e.g. Panasonic PGS 0.1 mm thickness).
Dimensions see
Figure 2.
The fixing is done by two screws.
Recommendation for screw dimensions: ISO 7045 - M1.6 x 6 - A2 50 - H.
The screws have to be fixed with 10 Ncm.
1)
x = K for 1.25 Gbit/s
x = U for 1.6 Gbit/s
x = Q for 2.7 Gbit/s
PAROLI
廬
is a registered trademark of Infineon Technologies
Data Sheet
1
2003-07-25
1
2
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