VTM
V鈥 Chip 鈥?VTM
Voltage Transformation Module
TM
V048K015T090
K indicates BGA configuration. For other
mounting options see Part Numbering below.
鈥?48 V to 1.5 V V鈥 Chip Converter
鈥?90 A (135 A for 1 ms)
鈥?High density 鈥?360 A/in
3
鈥?Small footprint 鈥?84 A/in
2
鈥?Low weight 鈥?0.5 oz (14 g)
鈥?Pick & Place / SMD
Product Description
鈥?125擄C operation
鈥?1 碌s transient response
鈥?>3.5 million hours MTBF
鈥?Typical efficiency 93% at 1.5 V/50 A
鈥?No output filtering required
鈥?BGA or J-Lead packages
Actual size
漏
V
f
= 26 - 55 V
V
OUT
= 0.8 - 1.7 V
I
OUT
= 90 A
K =
1/32
R
OUT
= 1.2 m鈩?max
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
TM to -In
VC to -In
+Out to -Out
Isolation voltage
Operating junction temperature
Output current
The
Chip Voltage Transformation
Module (VTM) breaks records for speed, density and
efficiency to meet the demands of advanced DSP,
FPGA, ASIC, processor cores and microprocessor
applications at the point of load (POL) while providing
isolation from input to output. It achieves a response
time of less than 1 碌s and delivers up to 90 A in a
volume of less than 0.25 in
3
while providing low output
voltages with unprecedented efficiency. It may be
paralleled to deliver hundreds of amps at an output
voltage settable from 0.8 to 1.7 Vdc.
The VTM V048K015T090鈥檚 nominal output voltage is
1.5 Vdc from a 48 Vdc input factorized bus, V
f
, and is
controllable from 0.8 to 1.7 Vdc at no load, and from
0.8 to 1.6 Vdc at full load, over a V
f
input range of 26
to 55 Vdc. It can be operated either open- or closed-loop
depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its V
f
input voltage with a transformation ratio,
K = 1/32, and an output resistance, R
OUT
= 1.0 milliohm, to
enable applications requiring a programmable low
output voltage at high current and high efficiency.
Closing the loop back to an input Pre-Regulation
Module (PRM) or DC-DC converter can compensate
for R
OUT
.
V048K015T090 V
鈥?/div>
I
Values
-1.0 to 60.0
100
-0.3 to 7.0
-0.3 to 7.0
-0.3 to 19.0
-0.1 to 4.0
2,250
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
Notes
For 100 ms
P
L
E
R
IN
IM
Peak output current
Case temperature during reflow
Storage temperature
Output power
Peak output power
-40 to 125
90
135
208
Y
R
A
Vdc
Vdc
擄C
A
See Note
Continuous
A
For 1 ms
擄C
擄C
W
W
Continuous
For 1 ms
Input to Output
-40 to 150
145
217
Note:
The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
Part Numbering
The 1.5 V VTM achieves break-through current density
of 360 A/in
3
in a V
鈥?/div>
I Chip package compatible with
standard pick-and-place and surface mount assembly
processes. The V
鈥?/div>
I Chip BGA package supports in-board
mounting with a low profile of 0.16" (4 mm) over the
board. A J-lead package option supports on-board
surface mounting with a profile of only 0.25" (6 mm)
over the board. The VTM鈥檚 fast dynamic response and
low noise eliminate the need for bulk capacitance at the
load, substantially increasing the POL density while
improving reliability and decreasing cost.
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V
Voltage
Transformation
Module
048
Input Voltage
Designator
K
015
Output Voltage
Designator
(=V
OUT
x10)
T
090
Output Current
Designator
(=I
OUT
)
Configuration Options
A = On-board, elevated (Fig.16)
F = On-board (Fig.15)
K = In-board (Fig.14)
Product Grade Temperatures (擄C)
Grade
Storage
Operating
T
-40 to150 -40 to125
V鈥 Chip Voltage Transformation Module
V048K015T090
Rev. 1.0
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