UPWLEDxx
HIGH BRIGHTNESS WHITE LED
P
RODUCT
P
REVIEW
KEY FEATURES
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Microsemi
.C
OM
The UPWLEDxx product incorporates Microsemi鈥檚 unique, patented packaging
concept to improve the homogeneous distribution of white light. The Optomite
package has low thermal resistance, <130擄C/W. The package gives a broad
luminous emission, >170擄. The packaging characteristics lend themselves to
increased life, critical to many white applications.
IMPORTANT:
For the most current data, consult
MICROSEMI鈥檚
website:
http://www.microsemi.com
Low Thermal Resistance
Rugged Optomite 0603 package
High Brightness
No UV bleed through
Broad angular Luminous
Emission
Suited for high reliability
applications
APPLICATIONS
ABSOLUTE MAXIMUM RATINGS AT 25潞 C
(UNLESS OTHERWISE SPECIFIED)
Parameters
Forward dc Drive Current
Peak Forward Current (non-repetative)
LED Operating Junction Temperature
Reverse Voltage
Power Dissipation @ 30mA
Operating Temperature
Storage Temperature
Electrostatic Discharge
ESD classification
Symbol
I
F
I
FP
Tj
V
R
P
D
T
OPR
T
S
ESD
Value
30
100
-40 to +150
8
125
-40 to +125
-45 to +150
1000
Class 2
Unit
DC
mA
mA
擄C
V
mW
擄C
擄C
V
Mobil Phone Keypad
Panel, button, switch indicators.
Backlighting
Signage
Signals and Marker Lights
THERMAL CHARACTERISTICS
(UNLESS OTHERWISE SPECIFIED)
Value
Units
Thermal Resistance
Symbol
Junction-to Soldering Point
R
胃JS
110
擄C/W
NOTE: The 鈥渪 x 鈥渢railer in the part number refers to the intensity bin followed by color
rank. (see table). For operation of these LEDs in pulse mode applications, devices
may be used in conjunction with Micorsemi LX1992LED Drivers.
UPWLEDXX
UPWLEDXX
Anode is the smaller of the two base pads
.
Mount to circuit using 60/40 Pb/Sn or equivalent.
Maximum solder melt exposure temperature is 230擄C for 10 seconds.
Copyright
錚?/div>
2002
2003-01-15
Microsemi
580 Pleasant Street, Watertown, MA. 02472-2408, 617-926-0404, Fax: 617-924-1235
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