鈥?/div>
Case: Molded Epoxy
Epoxy Meets UL94, VO at 1/8"
Weight: 72 mg (approximately)
Device Marking: S840
Lead and Mounting Surface Temperature for Soldering Purposes,
260擄C Maximum for 10 Seconds
擄
K
A
A
Maximum Ratings
RATING
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current (At Rated V
R,
T
C
= 100擄C)
擄
Non-Repetitive Peak Surge Current
(Non-Repetitive peak surge current with 8A I
O
)
Storage Temperature
Operating Temperature
Voltage Rate of Change (Rated V
R
, T
J
= 25擄C)
擄
SYMBOL
V
RRM
V
RWM
V
R
I
O
I
FSM
T
stg,
T
C
T
J
dv/dt
VALUE
40
UNIT
V
8
150
-55 to 150
-55 to 125
1000
A
A
擄
C
擄
C
V/碌s
碌
擄
C/W
Thermal Characteristics
Thermal Resistance - Junction-to-Case
Thermal Resistance - Junction-to-Ambient
R
tjtab
R
tja
2.5
130
Electrical Characteristics
Maximum Instantaneous Forward Voltage (1)
(I
F
= 3 A)
(I
F
= 8 A)
(I
F
= 10 A)
Maximum Instantaneous Reverse Current
(V
R
= 40 V)
(1) Pulse Test: Pulse Width
鈮?/div>
400
碌
s, Duty Cycle
鈮?/div>
2%.
V
F
I
R
T
J
= 25擄C
擄
0.37
0.45
0.49
T
J
= 25擄C
擄
5
V
mA
MSCO993.PDF 11-10-99
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