UPS540
W ATE R TOW N DIVISI ON
SCHOTTKY BARRIER RECTIFIER
0.5 AMP, 40 VOLT
KEY FEATURES
DESCRIPTION
W W W .
Microsemi
.COM
In Microsemi鈥檚 new Powermite SMT Package, these high efficiency Schottky
rectifiers offer power handling capabilities previously found only in much
larger packages. They are ideal for SMD applications that operate at high
frequencies.
In addition to its size advantages, Powermite package features include a full
metallic bottom that eliminates the possibility of solder flux entrapment during
assembly, and a unique locking tab acts as an integral heat sink. Its
innovative design makes this device ideal for use with automatic insertion
equipment.
!"
Low Profile 鈥?Maximum
height of 1.1 mm
!"
Footprint Area of 10 mm
!"
Low V
F
Provides Higher
Efficiency
!"
Low Thermal Resistance with
Direct Thermal Path of Die on
Exposed Cathode Heat Sink
!"
Supplied in 8mm Tape and
Reel 鈥?/div>
3,000 units/7鈥?Reel;
12,000 units/13鈥?Reel
SURFACE MOU
NT
POWERMITE餂?/div>
Surface Mount Power Package
餂?/div>
APPLICATIONS/BENEFITS
APPLICATIONS/BENEFITS
IMPORTANT:
For the most current data, consult
MICROSEMI鈥檚
website:
http://www.microsemi.com
!"
High power Surface Mount
Package
!"
Guard Ring Protection
!"
Low forward voltage
!"
Integral Heat Sink/Locking
Tabs
!"
Compatible with Automatic
Insertion Equipment
!"
Full Metallic Bottom
Eliminates Flux Entrapment
MECHANICAL CHARACTERISTICS
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
Case: Molded Epoxy
Meets UL94VO at 1/8 inch
Device Marking S54
Lead and Mounting Surface Temperature for
Soldering = 260擄C Maximum
for 10 Seconds
UPS540
UPS540
Copyright
錚?/div>
2000
MSC1634.PDF 2000-12-01
Microsemi
Watertown Division
580 Pleasant Street Watertown, MA 02472 617-926-0404, Fax: 617-924-1235
Page 1
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