UPS115U
C OL OR AD O DIVISIO N
ULTRA LOW V
F
SCHOTTKY BARRIER RECTIFIER
1.0 AMP, 15 VOLT
DESCRIPTION
KEY FEATURES
W W W.
Microsemi
.COM
In Microsemi鈥檚 new Powermite SMT Package, these high efficiency Schottky
rectifiers offer power handling capabilities previously found only in much
larger packages. They are ideal for SMD applications that operate at high
frequencies.
In addition to its size advantages, Powermite package features include a full
metallic bottom that eliminates the possibility of solder flux entrapment during
assembly, and a unique locking tab acts as an integral heat sink. Its
innovative design makes this device ideal for use with automatic insertion
equipment
Low Profile 鈥?Maximum
height of 1.1 mm
2
Footprint Area of 10 mm
Low V
F
Provides Higher
Efficiency
Low Thermal Resistance
with Direct Thermal Path
of Die on Exposed
Cathode Heat Sink
Supplied in 8mm Tape
and Reel 鈥?/div>
3,000 units/7鈥?/div>
Reel; 12,000 units/13鈥?Reel
SURFACE MOUNT
POWERMITE餂?/div>
Surface Mount Power Package
餂?/div>
APPLICATIONS/BENEFITS
APPLICATIONS/BENEFITS
High power Surface Mount
Package
Guard Ring Protection
Ultra Low forward voltage
Integral Heat Sink/Locking Tabs
Compatible with Automatic
Insertion Equipment
Full Metallic Bottom Eliminates
Flux Entrapment
High Surge Capacity
Ideal for OR鈥檌ng Diode
IMPORTANT:
For the most current data, consult
MICROSEMI鈥檚
website:
http://www.microsemi.com
MECHANICAL CHARACTERISTICS
鈥?
鈥?
鈥?
鈥?
Case: Molded Epoxy
Meets UL94VO at 1/8 inch
Device Marking S15U
Lead and Mounting Surface Temperature for
Soldering = 260擄C Maximum
for 10 Seconds
UPS115U
UPS115U
Copyright 2000
MSCXXXX 2002-5-16 Rev. 2
Microsemi
Colorado Division
800 Hoyt Street, Broomfield CO. 303-469-2161, Fax: 303-466-3775
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