UPF1N50
W ATE R TOW N DIVISI ON
SURFACE MOUNT N CHANNEL MOSFET
PRELIMINARY
DESCRIPTION
KEY FEATURES
W W W .
Microsemi
.COM
Power MOSFET in ultra low profile patented Powermite 3(TM) package
provides the designer with the best combination of fast Switching,
ruggedized device design, low on-resistance, cost effectiveness in the
industry's smallest high power surface mount package.
The UPF1N50 is ideal for ultra small motor control and switch mode power
supply applications.
The Powermite 3 is designed for surface mounting using vapor phase,
infrared, or wave soldering techniques. With power dissipation levels up to
1.8 Watts, the Powermite 3 offers similar power handling capability to device
4 times its size by using a patented full metal wrap around bottom.
IMPORTANT:
For the most current data, consult
MICROSEMI鈥檚
website:
http://www.microsemi.com
!"POWERMITE
3 Surface Mount
Package
!"Low
On-State Resistance
!"High
Frequency Switching
!"Ultra
Low Leakage current
!"Integral
Heat Sink / Locking
Tabs
!"Supplied
in 16mm Tape and
Reel 鈥?6000 units/reel
!"Superior
Low Thermal And
Electrical capability
APPLICATIONS/BENEFITS
APPLICATIONS/BENEFITS
鈥?/div>
Motor Control
鈥?/div>
Switch Mode Power Supplies
MECHANICAL CHARACTERISTICS
POWERMITE 3 Surface Mount Package
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
Footprint Area of 16.51 mm
Case: Molded Epoxy
Meets UL94VO at 1/8 inch
Weight: 72 milligrams
Lead and Mounting Temperatures: 260
0
C max for 10 seconds
2
MAXIMUM RATINGS
PARAMETER
Drain-to-Source Voltage
Drain-to-Source Voltage
Continuous Drain Current @ TC = 25潞C
Continuous Drain Current @ TC = 100潞C
Operating & Storage Junction Temperature Range
Total Power Dissipation
SYMBOL
V
DSS
V
GS
I
D1
I
D2
T
J,
T
STG
PD (1)
VALUE
UNIT
500
+/-20
1.0
0.8
- 40 to + 125
1.8
Volts
Volts
Amps
Amps
潞C
Watts
THERMAL CHARACTERISTICS
S
TEADY
-
STATE
T
HERMAL
R
ESISTANCE
:
Junction-to-Tab
(1) Junction-to-ambient
(2) Junction-to-ambient
SYMBOL
R胃
J-TAB
R胃JA (1)
R胃JA (2)
VALUE
2.0
55
120
UNIT
擄C/Watts
擄C/Watts
擄C/Watts
UPF1N50
UPF1N50
(1) Mounted on 2鈥?square by 0.06鈥?thick FR4 board with a 1鈥澝?1鈥?square 2-ounce copper pattern.
(2) Mounted on 0.06鈥?thick FR4 board, using recommended footprint.
Copyright
錚?/div>
2000
MSC1541.PDF 2000-08-08
Microsemi
Watertown Division
580 Pleasant Street, Watertown, MA. 02472, 617-926-0404, Fax: 617-924-1235
Page 1
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SURFACE MOUNT N CHANNEL MOSFET
MICROSEMI
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SURFACE MOUNT N . CHANNEL MOSFET
MICROSEMI
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