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UPC2771T-E3 Datasheet

  • UPC2771T-E3

  • Microwave/Millimeter Wave Amplifier

  • 14頁(yè)

  • ETC

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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
碌
PC2771T
MEDIUM-POWER HIGH-FREQUENCY AMPLIFIER FOR
3 V DIGITAL CELLULAR TELEPHONE
The
碌
PC2771T is a silicon monolithic integrated circuit designed as the transmission PA鈥檚 driver for digital cellular
telephones. This +11.5 dBm P
1db
driver can get back-off to PA input level.
3 V supply operation is suitable for low voltage systems.
Due to the 50
鈩?/div>
cascadable and mini-mold package, this IC is suitable for high-density surface mounting.
The
碌
PC2771T is manufactured using NEC鈥檚 NESAT
TM
III silicon bipolar process (f
T
= 20 GHz). This process uses
a silicon nitride passivation film and gold electrodes. These materials protect the chip鈥檚 surface, prevent corrosion
and feature the low current and high-frequency characteristics transistors. Thus, this IC has excellent reliability and
electrical performance.
FEATURES
鈥?Supply voltage
鈥?Medium output power
鈥?Recommended operating frequency
鈥?Insertion power gain
鈥?50
鈩?/div>
cascadable
鈥?Adjacent channel interference
: V
CC
= 3.0 V 50.3 V
: P
1dB
= +11.5 dBm
TYP
. @ 0.9 GHz (with inductance to gain wide-band)
P
1dB
= +9.5 dBm
TYP
. @ 1.5 GHz (with inductance to gain wide-band)
: 800 MHz to 1.9 GHz
: G
P
= 21 dB
TYP
. @ 0.9 GHz
G
P
= 20 dB
TYP
. @ 1.5 GHz
: 50
鈩?/div>
input/output impedance
: 6-pin mini-mold package
: 鈥?0 dBc (typ.) @ f = 900 MHz,
(for reference purposes only)
f =
鹵50
kHz, P
O
= +7 dBm
鈥?High-density surface mounting possible
ORDERING INFORMATION
PART NUMBER
PACKAGE
6-pin mini-mold
MARKING
C2H
ARRANGEMENT
Embossed tape 8 mm wide. Pins 1, 2, and 3
facing the perforations. 3 000 units/reel.
碌
PC2771T-E3
Remark
To order evaluation samples, please contact your local NEC sales office (specify
碌
PC2771T).
Caution: Electro-static sensitive devices
Document No. P10894EJ2V0DS00 (2nd edition)
(Previous No. ID-3489)
Date Published February 1996 P
Printed in Japan
漏
1996

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