鈥?/div>
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
Available in 8 mm, 7 inch/3000 Unit Tape and Reel
Pb鈭扚ree Packages are Available
MARKING
DIAGRAM
5
SC鈭?8A/SOT鈭?53
CASE 419A
STYLE 6
1
4
Ux M
G
G
2
3
MAXIMUM RATINGS
(T
A
= 25擄C unless otherwise noted, common for Q
1
and Q
2
, 鈭?minus sign for Q
1
(PNP) omitted)
Rating
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current
Symbol
V
CBO
V
CEO
I
C
Value
50
50
100
Unit
Vdc
Vdc
mAdc
Ux
= Device Marking
x
= 2, 3 or 5
M
= Date Code
G
= Pb鈭扚ree Package
(Note: Microdot may be in either location)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
THERMAL CHARACTERISTICS
Thermal Resistance 鈭?Junction-to-Ambient
(surface mounted)
Operating and Storage Temperature Range
Total Package Dissipation
@ T
A
= 25擄C (Note 1)
R
qJA
T
J
, T
stg
P
D
833
鈭?5 to
+150
*150
擄C/W
擄C
mW
Preferred
devices are recommended choices for future use
and best overall value.
1. Device mounted on a FR-4 glass epoxy printed circuit board using the
minimum recommended footprint.
漏
Semiconductor Components Industries, LLC, 2006
1
April, 2006 鈭?Rev. 6
Publication Order Number:
UMC2NT1/D