鈥?/div>
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
Pb鈭扚ree Packages are Available
MARKING
DIAGRAM
MAXIMUM RATINGS
(T
A
= 25擄C unless otherwise noted, common for Q
1
and Q
2
, 鈭?minus sign for Q
1
(PNP) omitted)
Rating
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current
Symbol
V
CBO
V
CEO
I
C
Value
50
50
100
Unit
Vdc
Vdc
mAdc
SC鈭?8A/SOT鈭?53
CASE 419A
STYLE 7
Ux M
G
G
THERMAL CHARACTERISTICS
Thermal Resistance, Junction-to-Ambient
(Surface Mounted)
Operating and Storage Temperature Range
Total Package Dissipation @ T
A
= 25擄C
(Note 1)
R
qJA
T
J
, T
stg
P
D
833
鈭?5 to +150
*150
擄C/W
擄C
mW
Ux = Device Code
x = 0 or 1
M = Date Code
G
= Pb鈭扚ree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
UMA4NT1
UMA4NT1G
UMA6NT1
Package
SOT鈭?53
SOT鈭?53
(Pb鈭扚ree)
SOT鈭?53
SOT鈭?53
(Pb鈭扚ree)
Shipping
鈥?/div>
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a FR-4 glass epoxy printed circuit board using the
minimum recommended footprint.
DEVICE RESISTOR VALUES
Device
UMA4NT1
UMA6NT1
R1 (K)
10
47
R2 (K)
鈭?/div>
鈭?/div>
UMA6NT1G
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Preferred
devices are recommended choices for future use
and best overall value.
漏
Semiconductor Components Industries, LLC, 2006
1
May, 2006 鈭?Rev. 4
Publication Order Number:
UMA4NT1/D
next