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Glass passivated chip junction
MECHANICAL DATA
Case: JEDEC TO-263AB molded plastic body
Terminals: Plated leads, solderable per MIL-STD-750,
Method 2026
Polarity: As marked
Mounting Position: Any
Mounting Torque: 5 in. - lbs. max.
Weight: 0.08 ounce, 2.24 grams
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
UGB10FCT
UGB10GCT
UNITS
Maximum repetitive peak reverse voltage
Working peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at T
C
=100擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) per leg
Maximum instantaneous forward voltage per leg
I
F
= 5A
Maximum reverse leakage current
at working peak reverse voltage
Maximum Reverse recovery time per leg at
I
F
=1.0A, di/dt=100A/碌s, V
R
=30V, I
rr
=0.1 I
RM
Maximum reverse recovery time per leg at I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
Maximum reverse recovery current per leg at
I
F
=5A, di/dt=50A/碌s,V
R
=30V
T
C
=100擄C
Maximum stored charge per leg
I
F
=2A, di/dt=20A/碌s, V
R
=30V, I
rr
=0.1 I
RM
Typical thermal resistance from junction to case per leg
Operating junction and storage temperature range
NOTE: (1) Pulse test: 300碌s pulse width, 1% duty cycle
NOTICE: Advanced product information is subject to change without notice
V
RRM
V
RWM
V
RMS
V
DC
I
(AV)
I
FSM
T
J
=25擄C
T
J
=150擄C
T
J
=25擄C
T
J
=100擄C
300
225
210
300
10
60A
1.30
1.05
10
200
50
35
3.0
50
400
300
280
400
Volts
Volts
Volts
Volts
Amps
Amps
V
F
I
R
t
rr
t
rr
I
RM
Q
rr
R
螛JC
T
J
, T
STG
Volts
碌A(chǔ)
ns
ns
Amps
nC
擄C/W
擄C
4.5
-40 to +150
4/98
1
2
3
