鈾?/div>
High temperature soldering guaranteed:
250擄C, 0.16鈥?(4.06) from case for 10 seconds
0.113 (2.87)
0.103 (2.62)
0.145 (3.68)
0.135 (3.43)
0.560 (14.22)
0.530 (13.46)
0.410 (10.41)
0.390 (9.91)
PIN
1
0.160 (4.06)
0.140 (3.56)
0.560 (14.22)
0.530 (13.46)
2
0.635 (16.13)
0.625 (15.87)
0.350 (8.89)
0.330 (8.38)
1.148 (29.16)
1.118 (28.40)
0.110 (2.79)
0.100 (2.54)
MECHANICAL DATA
0.105 (2.67)
0.095 (2.41)
0.037 (0.94)
0.027 (0.68)
0.022 (0.56)
0.014 (0.36)
PIN 1
0.205 (5.20)
0.195 (4.95)
PIN 2
CASE
Dimensions in inches and (millimeters)
Case:
JEDEC TO-220AC molded plastic body over
passivated chip
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Mounting Torque:
5in. - lbs. max.
Weight:
0.064 ounce, 1.81 grams
MAXIMUM RATINGS AND CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
UG8AT
UG8BT
UG8CT
UG8DT
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=100擄C
Peak forward surge current
8.3 ms single half sine-wave superimposed
on rated load (JEDEC Method) at T
C
=100擄C
Maximum instantaneous forward voltage at 8.0
20A
5.0A, T
J
=150擄C
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time
(NOTE 1)
Maximum reverse recovery time
(NOTE 2)
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
50
35
50
100
70
100
8.0
150
105
150
200
140
200
Volts
Volts
Volts
Amps
Amps
150.0
1.00
1.20
0.95
10.0
300.0
20.0
30.0
50.0
20.0
45.0
45.0
4.0
-55 to+150
V
F
I
R
t
rr
Volts
碌A
ns
ns
nC
pF
擄C/W
擄C
T
A
=25擄C
T
A
=100擄C
T
J
=25擄C
T
J
=100擄C
T
J
=25擄C
T
J
=100擄C
t
rr
Q
rr
C
J
R
螛JC
T
J
, T
STG
Maximum recovered stored charge
(NOTE 2)
Typical junction capacitance
Typical thermal resistance
(NOTE 3)
(NOTE 4)
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) t
rr
and Q
rr
measured at I
F
=8.0A, V
R
=30V, di/dt=50A/碌s, I
rr
=10% I
RM
for meaurement of t
rr
(3) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(4) Thermal resistance from junction to case
10/23/98
1
2
