鈾?/div>
High temperature soldering guaranteed:
250擄C, 0.16鈥?(4.06mm) from case for 10 seconds
0.170
(4.3)
0.840 (21.3)
0.820 (20.8)
10
o
TYP.
BOTH SIDES
0.142 (3.6)
0.138 (3.5)
1
2
3
0.086 (2.18)
0.076 (1.93)
1
o
REF.
BOTH SIDES
0.118 (3.0)
0.108 (2.7)
0.127 (3.22)
0.160 (4.1)
0.140 (3.5)
0.795 (20.2)
0.775 (19.6)
0.117 (2.97)
MECHANICAL DATA
0.048 (1.22)
0.225 (5.7)
0.205 (5.2)
0.044 (1.12)
0.030 (0.76)
0.020 (0.51)
PIN 2
CASE
PIN 1
PIN 3
Dimensions in inches and (millimeters)
Case:
JEDEC TO-247AD molded plastic body over
passivated chips
Terminals:
Plated leads solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
2.2 ounces, 6.3 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
UG30APT
UG30BPT
UG30CPT
UG30DPT
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at T
C
=120擄C
Peak forward surge current
8.3 ms single half sine-wave superimposed
on rated load (JEDEC Method) at T
C
=120擄C
Maximum instantaneous forward voltage
per leg at 15A
30A
10A T
J
=100擄C
Maximum DC reverse current at
rated DC blocking voltage per leg
Maximum reverse recovery time
Maximum reverse recovery time
(NOTE 2)
(NOTE 1)
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
50
35
50
100
70
100
30.0
300.0
150
105
150
200
140
200
Volts
Volts
Volts
Amps
Amps
V
F
T
A
=25擄C
T
A
=100擄C
T
J
= 25擄C
T
J
=100擄C
T
J
=25擄C
T
J
=100擄C
1.0
1.15
0.85
5.0
800.0
20.0
35.0
50.0
22.0
50.0
70.0
2.0
-65 to +150
Volts
I
R
t
rr
t
rr
Q
rr
C
J
R
螛JC
T
J
, T
STG
碌A(chǔ)
ns
ns
nC
pF
擄C/W
擄C
Maximum recovered stored charge
(NOTE 2)
Typical junction capacitance
Typical thermal resistance
(NOTE 3)
(NOTE 4)
Operating and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, Irr=0.25A
(2) t
rr
and Q
rr
measured at: I
F
=15A V
R
=30V, di/dt=50 A/碌s, I
RR
=10% I
RM
for measurement of t
rr
(3) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(4) Thermal resistance from junction to case per leg mounted on heatsink
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