鈾?/div>
High temperature soldering guaranteed:
250擄C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
FEATURES
0.100 (2.54)
0.090 (2.29)
DIA
1.0 (25.4)
MIN.
0.125 (3.18)
0.115 (2.92)
1.0 (25.4)
MIN.
0.025 (0.635)
0.023 (0.584)
DIA.
MECHANICAL DATA
Case:
Void free molded plastic body over passivated chip
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
WeIght:
0.0064 ounce, 0.181 gram
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
UG06A
UG06B
UG06C
UG06D
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
L
=75擄C
Peak forward surge current
8.3 ms single half sine-wave superimposed
on rated load (JEDEC Method) at T
L
=75擄C
Maximum instantaneous forward voltage at 0.6A
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time
(NOTE 1)
Maximum reverse recovery time
(NOTE 2)
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
t
rr
T
J
=25擄C
T
J
=100擄C
T
J
=25擄C
T
J
=100擄C
t
rr
Q
rr
C
J
R
螛JA
R
螛JL
T
J
, T
STG
50
35
50
100
70
100
0.6
40.0
0.95
150
105
150
200
140
200
Volts
Volts
Volts
Amp
Amps
Volts
碌A(chǔ)
ns
ns
nC
pF
擄C/W
擄C
T
A
=25擄C
T
A
=100擄C
5.0
100.0
15.0
25.0
35.0
8.0
20.0
9.0
97.0
28.0
-55 to +150
Maximum recovered stored charge
(NOTE 2)
Typical junction capacitance
Typical thermal resistance
(NOTE 3)
(NOTE 4)
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A,I
rr
=0.25A
(2) t
rr
and Q
rr
measured at I
F
=0.6A: V
R
=30V, di/dt=50A/碌s, I
rr
=10% I
RM
for meaurement of t
rr
(3) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(4) Thermal resistance from junction to ambient and junction to lead at 0.375" (9.5mm) lead length
P.C.B. mounted with 0.2 x 0.2鈥?(5.0 x 5.0mm) copper pads
4/98
1
2
