錚?/div>
P
D
R
qJA
T
J
, T
stg
T
L
Air
Contact
Symbol
Value
鹵30
鹵30
40
16
400
240
1.9
525
鈭?5 to
+150
260
Unit
kV
A
kV
V
mW
mW/擄C
擄C/W
擄C
擄C
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
Total Power Dissipation on FR鈭? Board
(Note 1) @ T
A
= 25擄C
Derate above 25擄C
Thermal Resistance Junction鈭抰o鈭扐mbient
Junction and Storage Temperature Range
Lead Solder Temperature 鈭?Maximum
(10 Second Duration)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR鈭? = 1.0 x 0.75 x 0.62 in.
漏
Semiconductor Components Industries, LLC, 2005
1
April, 2005 鈭?Rev. 0
Publication Order Number:
mESD3.3DT5G/D