鈩?/div>
I
D
= -2.5 A
D-PAK
2
1
3
I-PAK
2
3
1. Gate 2. Drain 3. Source
Absolute Maximum Ratings
Symbol
V
DSS
I
D
I
DM
V
GS
E
AS
I
AR
E
AR
dv/dt
P
D
Characteristic
Drain-to-Source Voltage
Continuous Drain Current (T
C
=25 C)
Continuous Drain Current (T
C
=100 C)
Drain Current-Pulsed
Gate-to-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Total Power Dissipation (T
A
=25 C) *
Total Power Dissipation (T
C
=25 C)
Linear Derating Factor
T
J
, T
STG
T
L
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8 鈥?from case for 5-seconds
o
o
2
O
1
O
1
O
3
O
o
o
Value
-250
-2.5
-1.5
1
O
Units
V
A
A
V
mJ
A
mJ
V/ns
W
W
W/ C
o
-10
+ 30
_
156
-2.5
3.0
-4.8
2.5
30
0.24
- 55 to +150
o
C
300
Thermal Resistance
Symbol
R
胃
JC
R
胃
JA
R
胃
JA
Characteristic
Junction-to-Case
Junction-to-Ambient *
Junction-to-Ambient
Typ.
--
--
--
Max.
4.17
50
110
o
Units
C/W
*
When mounted on the minimum pad size recommended (PCB Mount).
Rev. B
漏1999 Fairchild Semiconductor Corporation