Fairchild Semiconductor Product Package Material Disclosure
Package Type
Weight of
Package (grams)
Component
Lead Frame
TSSOP-56
Maximum
Minimum
Material
2.21E-01
2.08E-01
Weight in
grams
7.37E-02
Copper
Nickel
Silicon
Magnesium
Silver (DP)
Substance in
material
Wt% in
finished
product min
33.34
32.08
1.00
0.22
0.05
0.00
58.07
35.92
0.00
8.98
0.30
0.90
Wt% in
finished
product max
35.41
33.66
1.06
0.23
0.05
0.40
61.66
47.89
0.90
20.65
1.80
2.39
CAS #
Copper alloy
7440-50-8
7439-89-6
7440-66-6
7439-95-4
7440-22-4
Encapsulation
Epoxy
1.28E-01
Silica
Carbon Black
Resin
Antimony
Compound
Brominated
Compound
1309-64-4
68541-56-0
Plating
Solder
8.84E-03
Tin
Lead
or
Lead-free
Solder
8.84E-03
Tin
1.90E-03
Silicon and trace
metals
2.22E-04
Silver
Resin
1.37
1.17
0.21
1.37
1.37
0.84
0.84
6.87
5.84
1.03
6.87
6.87
0.93
0.93
7440-31-5
7439-92-1
7440-31-5
Chip
Silicon and
inorganic
compounds
Adhesive
7440-21-3
Die Attach
0.10
0.07
0.02
0.62
0.11
0.08
0.03
0.68
0.68
7440-22-4
Wire Bond
Gold Wire
1.39E-03
Gold
0.62
7440-57-5
Materials Disclosure Disclaimer
The information provided in this Materials Disclosure is, to our knowledge, correct. However, there is no guarantee to completeness
or accuracy, as some information is derived from data sources outside the company. Also, there may not be information included in
this statement regarding the minute amounts of dopant and metal materials contained within the electrically active or passive devices
contained within the finished product.
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