鈾?/div>
High temperature soldering:
250擄C/10 seconds at terminals
TE
D
MECHANICAL DATA
Case:
JEDEC DO-214AB molded plastic body over
passivated junction
Terminals:
Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes positive end (cathode)
Mounting Position:
Any
Weight:
0.007 ounces, 0.2 gram
Dimensions in inches and (millimeters)
Available in uni-directional only
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
VALUE
UNITS
Peak pulse power dissipation with a 10/1000碌s
waveform
(NOTES 1, 2, FIG. 3)
Peak power pulse current with a 10/1000碌s
waveform
(NOTE 1, FIG. 1)
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
(NOTES 2, 3)
Maximum instantaneous forward voltage at 100A
(NOTE 3)
Operating junction and storage temperature range
P
PPM
I
PPM
Minimum 1500
SEE TABLE 1
Watts
Amps
I
FSM
V
F
T
J,
T
STG
200.0
3.5
-65 to +185
Amps
Volts
擄C
NOTES:
(1) Non-repetitive current pulse, per Fig.3 and derated above T
A
=25擄C per Fig. 2
(2) Mounted on 0.31 X 0.31鈥?(8.0 X 8.0mm
)
copper pads to each terminal
(3) Measured on 8.3ms single half sine-wave, or equivalent square wave, duty cycle=4 pulses per minute maximum
1/27/99