ROUT鈥?/div>
GND
description
The TPA0172 is a stereo audio power amplifier in a 24-pin TSSOP thermally enhanced package capable of
delivering 2 W of continuous RMS power per channel into 4-鈩?loads. This device utilizes the I
2
C bus to control
its functionality, which minimizes the number of external components needed, simplifies the design, and frees
up board space for other features. When driving 1 W into 8-鈩?speakers, the TPA0172 has less than 0.2% THD+N
from 20 Hz to 20 kHz.
Included within this device is integrated depop circuitry that virtually eliminates transients that cause noise in
the speakers at power up, power down, and while transitioning in and out of shutdown mode.
The overall gain of the amplifier is controlled digitally by the volume control registers which are programmed
via the I
2
C interface. At power up, the amplifier defaults to 鈥?0 dB in BTL mode, or 鈥?6 dB in SE mode. There
are four registers that contain the gains: left BTL, right BTL, left SE, and right SE. Each register contains six bits,
which allows 64 gain steps from 鈥?0 dB to 20 dB in 1.25-dB steps, and two bits that mute the amplifier.
The TPA0172 only consumes 6.5 mA of supply current during normal operation. A shutdown mode is included
that reduces supply current to less than 15
碌A(chǔ).
The PowerPAD package (PWP) delivers a level of thermal performance that was previously achievable on
TO-200-type packages. Thermal impedances of approximately 35擄C/W are truly realized in multilayer PCB
applications. This allows the TPA0172 to operate at full power into 8-鈩?loads at ambient temperatures of 85擄C.
AVAILABLE OPTIONS
TA
鈥?40擄C to 85擄C
PACKAGED DEVICE
TSSOP鈥?/div>
(PWP)
TPA0172PWP
鈥?The PWP package is available taped and reeled. To order a taped and reeled part,
add the suffix R to the part number (e.g., TPA0172PWPR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
錚?/div>
2001, Texas Instruments Incorporated
POST OFFICE BOX 655303
鈥?/div>
DALLAS, TEXAS 75265
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