TI900-24-21.01-0.12
Thermal Pad White 24.00mm x 21.01mm Rectangle
616.00KB
1頁(yè)
掃碼查看芯片數(shù)據(jù)手冊(cè)
上傳產(chǎn)品規(guī)格書TI900 Silicone Based Thermally Conductive InsulatorsThermal Interface Product Selection
1
風(fēng)扇,熱管理
熱 - 墊,片
Ti900
片狀
矩形
24.00mm x 21.01mm
0.005"(0.127mm)
硅質(zhì)
-
膠粘
白
-
1.8 W/m-K
1168-1511