鈥?/div>
Point-to-Point Radio
Chip Dimensions 4.13 mm x 3.3 mm
(
)
Wafer Lot 9918802-1, -2, -3, +6V, ~ 880mA
22
20
Small-signal Gain (dB)
18
Performance Summary Table
Description
Performance Evaluation
Fixtured with Flare TFNs
33 to 36 GHz
> 17 dB nom, 34 - 35.2 GHz
> 17 dB nom, 33 - 36 GHz
~ 5 dB nom, 34 - 35.2 GHz
~ 5 dB nom. 33 鈥?36 GHz
> 8 dB nom, 34 - 35.2 GHz
> 7 dB nom, 33 - 36 GHz
32.3dBm min. 34 鈥?5.2 GHz
31.5dBm min, 34 鈥?35.2 GHz
over temp.
> 20% +25C
Tested under 鈥?6, +25, &
+100C
Predict: -43C
< 1.5 A max over operating
frequency and Temp. range
+6V
4.134 mm x 3.300 mm
2
13.6mm
16
14
Frequency range
Small signal gain
Input return loss
30
32
34
36
38
40
12
10
Frequency (GHz)
Output return loss
Output power
35
34
33
32
Pout (dBm)
31
30
29
28
27
26
25
32
33
34
35
Frequency (GHz)
36
37
P1dB_ave
Psat_ave
PAE
Operating temperature range
Ids
Vds
Die size
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
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