TC7MTX01FK
TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TC7MTX01FK
Digital temperature compensation IC
Due to the demand for compactness and lower power
dissipation, circuits for portable devices are being manufactured
as individual chips. In particular, during the manufacture of
modular devices comprised of several individual discrete devices,
significant time and effort must be devoted to adjusting the
temperature characteristic of each discrete device individually, In
addition, the demand for low power consumption is increasing.
In response to these requirements, Toshiba have developed the
TC7MTX01FX, a digital temperature compensation IC.
Toshiba have implemented this device completely in CMOS,
obviating the need to use combinations of individual electronic
components, such as thermistors and resistors, as was the case
Weight: 0.02 g (typ.)
previously. The new digital temperature compensation IC
incorporates a temperature sensor, an E
2
PROM and a DA
converter. The IC is accurate to within 鹵4潞C.
To meet the demand for compactness, the IC comes in the World鈥檚 smallest and flattest 16-pin package (US16).
Features
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Temperature compensation precision:
鹵4擄C (in the range
鈭?0~70擄C)
Analog output (XOcont):
Outputs an analog voltage whose level corresponds to 1擄C
increments in the above temperature range.
Control resolution: 10.98 mV (typ.)/Bit
Linearity: 鹵1LSB
Output response speed: 500 碌s
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Supply voltage operating range: 2.7~3.3 V
Built-in E
2
PROM : Write voltage 17 V (min)~19 V (max)
: Write time: 10 ms
Reference voltage (V
Ref
): 2.8 V (typ.)
Current dissipation: 1.0 mA (max) @25擄C
ESD: 鹵2000 V or more (MIL-STD method)
Latch-up: 鹵200 mA or more
Pin Layout
(top view)
DOUT
DIN
CK
STB
W/R
T1
T2
T3
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC
XOcont
Ref.
NC
GND
T4
Trig.1
V.P
Note:
All pins (T1~T4) must be connected to the V
CC
or the GND.
1
2002-03-18