TC253SPD 30
680
脳
500 PIXEL IMPACTRON錚?CCD IMAGE SENSOR
JULY 2003 鈭?SOCS085
D
Very Low Noise, High Sensitivity
D
Electronically Variable
High Resolution, 1/3-in Format, Solid State
Charge-Coupled Device (CCD) Frame
Transfer Image Sensor for Black and White,
NTSC, and Computer Applications
340,000 Pixels per Field
Frame Memory
656 (H)
脳
496 (V) Active Pixels in Image
Sensing Area Compatible With Electronic
Centering
Multimode Readout Capability
鈭?Progressive Scan
鈭?Interlace Scan
鈭?Line Summing
Fast Single-Pulse Clear Capability
Continuous Electronic Exposure Control
from 1/30 s to 1/5,000 s
7.4-
碌m
Square Pixels
Advanced Lateral Overflow Drain Low Dark
Current
High Photoresponse Uniformity Over a
Wide Spectral Range
Solid-State Reliability With No Image
Burn-In, Residual Imaging, Image
Distortion, Image Lag, or Microphonics
ODB 1
IAG2 2
SAG2 3
SRG1 4
SRG2 5
CMG 6
DUAL-IN-LINE PACKAGE
(TOP VIEW)
12 IAG1
11 SAG1
10 SUB
9 ADB
8 NC
7 V
OUT
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description
The TC253SPD-30 is a frame-transfer, CCD image sensor designed for use in black and white, NTSC TV,
computer, and special-purpose applications requiring high sensitivity, low noise, and small size.
The TC253SPD-30 is a new device of the IMPACTRON錚?family of very-low noise, high sensitivity image
sensors that multiply charge directly in the charge domain before conversion to voltage. The charge carrier
multiplication (CCM) is achieved by using a low-noise, single-carrier, impact ionization process that occurs
during repeated carrier transfers through high-field regions. Applying multiplication pulses to specially designed
gates activates the CCM. The amount of multiplication is adjustable according to the amplitude of multiplication
pulses. The device function resembles the function of image intensifiers implemented in solid state.
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,
Method 3015; however, it is advised that precautions be taken to avoid application of any voltage higher than maximum-rated
voltages to these high-impedance circuits. During storage or handling, the device leads should be shorted together or the device
should be placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriate logic-voltage level,
preferably either VCC or ground. Specific guidelines for handling devices of this type are contained in the publication
Guidelines for
Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies
available from Texas Instruments.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
IMPACTRON is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
錚?/div>
2003, Texas Instruments Incorporated
POST OFFICE BOX 655303
鈥?/div>
DALLAS, TEXAS 75265
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