鈥?/div>
High Isolation: 40 dB
Low Current draw: < 2mA @ +5 V
< 10mA @ -5V
5V CMOS Logic
45mm PBGA Package
JEDEC MO-151 Foot Print
PBGA Package Outline
Description
M/A-COM鈥檚 SW-461 is a multi-chip module containing six
SP4T GaAs switches, each with a driver/decoder and four
GaAs 6-way power dividers. The SW-461 utilizes Plastic Ball
Grid Array (PBGA) interconnect technology to achieve high
circuit density and superior high frequency performance. This
device is ideal for telephony applications in the AMPS
frequency bands.
The SW-461 is constructed with a multi layer PCB using a ball
grid array for the I/O connects. The combination of several
state-of-the-art technologies achieves high performance at a low
cost.
Ordering Information
Part Number
SW-461
Package
45mm PBGA Package
Electrical Specifications: T
A
= +25擄C
1
, Control Voltage = +5.0V
=
Parameter
Insertion Loss
VSWR
Isolation
Balance
P
1dB
1.
Test Conditions
800 - 900 MHz
800 - 900 MHz
800 - 900 MHz
800 - 900 MHz
800 - 900 MHz
Units
dB
dB
dB
dBm
Min.
42
Typ.
-11.5
1.5:1
57
0.7
33
Max.
-12
1.9:1
1.2
All measurements in a 50鈩?system.
Specifications subject to change without notice.
V2.00
V 2.0
North America:
Tel. (800) 366-2266, Fax (800) 618-8883
Asia/Pacific:
Tel.+81-44-844-8296, Fax +81-44-844-8298
Europe:
Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
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