鈾?/div>
High temperature soldering guaranteed:
260擄C/10 seconds, at 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
1.0 (25.4)
MIN.
0.042 (1.07)
0.037 (0.94)
DIA.
MECHANICAL DATA
Case:
Plastic molded body over passivated chip
Terminals:
Plated axial leads solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.03 ounces, 0.8 gram
Dimension in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
SUF15G
SUF15J
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current,
0.375" (9.5mm) lead length at T
A
=50擄C
Peak forward surge current, 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method) at T
A
=50擄C
Maximum instantaneous forward voltage at 1.5A
Maximum peak reverse current
at rated peak reverse voltage
Maximum reverse recovery time
(NOTE1)
Typical junction capacitance
(NOTE 2)
Typical thermal resistance
(NOTE 2)
Operating junction and storage temperature range
T
A
=25擄C
T
A
=100擄C
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
t
rr
C
J
R
螛JA
R
螛JL
T
J,
T
STG
400
280
400
1.5
50.0
1.80
10.0
100
35.0
35
65.0
20.0
-55 to +150
600
420
600
Volts
Volts
Volts
Amps
Amps
Volts
碌A(chǔ)
ns
pF
擄C/W
擄C
NOTES:
(1) Reverse recovery test condition: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
4/98
1
2
