鈩?/div>
EFFICIENT AND RELIABLE MOUNTING
THROUGH CLIP
鹵
30V GATE TO SOURCE VOLTAGE RATING
100% AVALANCHE TESTED
LOW INTRINSIC CAPACITANCE
GATE CHARGE MINIMIZED
REDUCED VOLTAGE SPREAD
1
2
3
DESCRIPTION
The Max247鈩?package is a new high volume
power package exibiting the same footprint as the
industry standard TO-247, but designed to acco-
modate much larger silicon chips, normally sup-
plied in bigger packages such as TO-264.The in-
creased die capacity makes the device idealto re-
duce component count in multiple paralleled de-
signs and save board space with respect to larger
APPLICATIONS
s
HIGH CURRENT, HIGH SPEED SWITCHING
s
SWITCH MODE POWER SUPPLY (SMPS)
s
DC-AC CONVERTER FOR WELDING
EQUIPMENT AND UNINTERRUPTABLE
POWER SUPPLY AND MOTOR DRIVE
ABSOLUTE MAXIMUM RATINGS
Symb ol
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
(鈥?
P
tot
T
s tg
T
j
Parameter
Drain-source Voltage (V
GS
= 0)
Drain- gate Voltage (R
GS
= 20 k
鈩?/div>
)
G ate-source Voltage
Drain Current (continuous) at T
c
= 25
o
C
Drain Current (continuous) at T
c
= 100 C
Drain Current (pulsed)
T otal Dissipation at T
c
= 25
o
C
Derating F actor
Storage Temperature
Max. O perating Junction Temperature
o
Max247鈩?/div>
INTERNAL SCHEMATIC DIAGRAM
Value
600
600
鹵
30
25
16.5
100
300
2.4
-55 to 150
150
Un it
V
V
V
A
A
A
W
W /
o
C
o
o
C
C
(
鈥?/div>
) Pulse width limited by safe operating area
March 1999
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