design rules of ST鈥檚 proprietary STripFET鈩?/div>
technology. This process compled to unique
metallization techniques realizes the most
advanced low voltage MOSFET in SO-8 ever
produced. The exposed slug reduces the R
thj-c
improving the current capability.
APPLICATIONS
s
SPECIFICALLY DESIGNED AND OPTIMISED
FOR HIGH EFFICIENCY CPU CORE DC/DC
CONVERTERS FOR MOBILE PC
S
INTERNAL SCHEMATIC DIAGRAM
DRAIN CONTACT ALSO ON THE BACKSIDE
ABSOLUTE MAXIMUM RATINGS
Symbol
V
DS
V
DGR
V
GS
I
D
I
D
I
D
I
DM
(鈥?
P
tot
Parameter
Drain-source Voltage (V
GS
= 0)
Drain-gate Voltage (R
GS
= 20 k鈩?
Gate- source Voltage
Drain Current (continuous) at T
C
= 25擄C
Drain Current (continuous) at T
C
= 25擄C (#)
Drain Current (continuous) at T
C
= 100擄C
Drain Current (pulsed)
Total Dissipation at T
C
= 25擄C
Total Dissipation at T
C
= 25擄C (#)
Value
30
30
鹵 18
100
22
62.5
400
70
3
Unit
V
V
V
A
A
A
A
W
W
(鈥?
Pulse width limited by safe operating area.
September 2003
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
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